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ISP1107
Advanced Universal Serial Bus transceiver
Rev. 01 -- 23 February 2000 Objective specification
1. General description
The ISP1107 is a Universal Serial Bus (USB) transceiver that is fully compliant with the Universal Serial Bus Specification Rev. 1.1. It is ideal for portable electronics devices such as mobile phones, digital still cameras and personal digital assistants. It allows 1.8 V, 2.5 V and 3.3 V USB Application Specific ICs (ASICs) and Programmable Logic Devices (PLDs) to interface with the physical layer of the Universal Serial Bus. It has an integrated 5 V to 3.3 V voltage regulator allowing direct powering from the USB supply VBUS. The ISP1107 can be used as a USB device transceiver or a USB host transceiver. It can transmit and receive serial data at both full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) data rates. The ISP1107 is compatible with the industry-standard Philips Semiconductors USB transceiver PDIUSBP11A.
2. Features
s s s s s s s s s s s s s s Complies with Universal Serial Bus Specification Rev. 1.1 Integrated 5 V to 3.3 V voltage regulator allowing direct powering from USB VBUS Used as a USB device transceiver or a USB host transceiver Supports full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) serial data rates Slew-rate controlled differential data driver Differential input receiver with wide common-mode range and very high input sensitivity Stable RCV output during SE0 condition Two single-ended receivers with hysteresis Low-power operation Three I/O voltage levels: 1.8 V, 2.5 V and 3.3 V Backward compatible with PDIUSBP11A Higher than 8 kV ESD protection Full industrial operating temperature range -40 to +85 C Available in small TSSOP16 and BCC16 packages.
c c
Philips Semiconductors
ISP1107
Advanced USB transceiver
3. Applications
s Portable electronic devices, such as x mobile phones x digital still cameras x personal digital assistants (PDA) x Internet appliances (IA).
4. Ordering information
Table 1: Ordering information Package Name ISP1107xx ISP1107DH
[1] In development.
Type number
Description plastic bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm
Version SOTxxx SOT403-1
BCC16 [1] TSSOP16
5. Functional diagram
handbook, full pagewidth
3.3 V V CC(I/O)
VOLTAGE REGULATOR
VCC(5.0) Vreg(3.3)
SOFTCON OE
Vpu(3.3) 1.5 k(2) D+ 33 (1) (1%) 33 (1) (1%)
FSE0 VO SUSPND RCV
D-
LEVEL SHIFTER
VP
VM
ISP1107
MGS962
GND
(1) Use a 39 resistor (1%) for a USB v2.0 compliant output impedance range. (2) Connect to D- for low-speed operation.
Fig 1. Functional diagram.
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6. Pinning information
6.1 Pinning
fpage
Vpu(3.3) 1 SOFTCON 2 OE 3 RCV 4
16 VCC(5.0) 15 Vreg(3.3) 14 FSE0 13 VO
ISP1107DH
VP 5 VM 6 SUSPND 7 GND 8
MGS961
12 D+ 11 D- 10 SPEED 9 V CC(I/O)
Fig 2. Pinning diagram BCC16 (to be added).
Fig 3. Pinning diagram TSSOP16.
6.2 Pin description
Table 2: Symbol Vpu(3.3) Pin description Pin 1 Type Description pull-up supply voltage (3.3 V 10%); used to connect an external 1.5 k resistor on D+ (full-speed) or D- (low-speed); pin function is controlled by input SOFTCON: SOFTCON = LOW -- Vpu(3.3) floating (high impedance) SOFTCON = HIGH -- Vpu(3.3) = 3.3 V SOFTCON 2 I software controlled USB connection input; a HIGH level applies 3.3 V to pin Vpu(3.3), which is connected to an external 1.5 k pull-up resistor; this allows USB connect/disconnect signalling to be controlled by software output enable input (CMOS level re. VCC(I/O), active LOW); enables the transceiver to transmit data on the USB bus differential data receiver output (CMOS level re. VCC(I/O)); driven LOW when input SUSPND is HIGH; the output state of RCV is preserved and stable during an SE0 condition single-ended D+ receiver output (CMOS level re. VCC(I/O)); used for external detection of single-ended zero (SE0), error conditions, speed of connected device; driven HIGH when VCC(5.0)/Vreg(3.3) are not connected to any voltage supply single-ended D- receiver output (CMOS level re. VCC(I/O)); used for external detection of single-ended zero (SE0), error conditions, speed of connected device; driven HIGH when no supply voltage is connected to VCC(5.0) or Vreg(3.3) suspend input (CMOS level re. VCC(I/O)); a HIGH level enables low-power state while the USB bus is inactive and drives output RCV to a LOW level
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OE RCV
3 4
I O
VP
5
O
VM
6
O
SUSPND
7
I
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Advanced USB transceiver
Pin description...continued Pin 8 9 Type Description ground supply supply voltage for digital I/O pins (1.65 to 3.6 V). Three voltage levels are supported: 1.8 V 0.15 V, 2.5 V 0.2 V and 3.3 V 0.3V; when VCC(I/O) is not connected, the D+/D- pins are in three-state speed selection input (CMOS level re. VCC(I/O)); adjusts the slew rate of differential data outputs D+ and D- according to the transmission speed: LOW: low-speed (1.5 Mbit/s) HIGH: full-speed (12 Mbit/s)
Table 2: Symbol GND VCC(I/O)
SPEED
10
I
D- D+ VO FSE0 Vreg(3.3)
11 12 13 14 15
AI/O AI/O I I -
negative USB data bus connection (analog, differential); for low-speed mode connect to pin Vpu(3.3) via a 1.5 k resistor positive USB data bus connection (analog, differential); for full-speed mode connect to pin Vpu(3.3) via a 1.5 k resistor differential driver data input (CMOS level re. VCC(I/O), Schmitt trigger); see Table 4 differential driver data input (CMOS level re. VCC(I/O), Schmitt trigger); see Table 4 regulated supply voltage output (3.0 to 3.6 V) during 5 V operation; used as supply voltage input for 3.3 V operation (3.3 V 10%) supply voltage for 5 V operation (4.0 to 5.5 V); can be connected directly to USB supply VBUS; connect this pin to Vreg(3.3) during 3.3 V operation
VCC(5.0)
16
-
7. Functional description
7.1 Function selection
Table 3: SUSPND L L H H
[1] [2] [3]
Function table OE L H L H D+/D- driving & receiving receiving [1] driving high-Z [1] RCV active active inactive [2] inactive [2] VP/VM active active active active Function normal driving (differential receiver active) receiving driving during `suspend' [3] (differential receiver inactive) low-power state
Signal levels on D+/D- are determined by other USB devices and external pull-up/down resistors. In `suspend' mode (SUSPND = HIGH) the differential receiver is inactive and output RCV is always LOW. Out-of-suspend (`K') signalling is detected via the single-ended receivers VP and VM. During suspend, the slew-rate control circuit of low-speed operation is disabled. The D+/D- are still driven to their intended states, without slew-rate control. This is permitted because driving during suspend is used to signal remote wakeup by driving a `K' signal (one transition from idle to `K' state) for a period of 1 to 15 ms.
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7.2 Operating functions
Table 4: L L H H Table 5: Driving function (OE = L) VO L H L H Receiving function (OE = H) D+/D- differential logic 0 differential logic 1 SE0
[1]
FSE0
Data differential logic 0 differential logic 1 SE0 SE0
RCV L H RCV* [1]
VP L H L
VM H L L
RCV* denotes the signal level on output RCV just before SE0 state occurs. This level is kept stable during the SE0 period.
7.3 Power supply configurations
The ISP1107 can be used with different power supply configurations, which can be changed dynamically. An overview is given in Table 6. Normal mode -- Both VCC(I/O) and VCC(5.0)/Vreg(3.3) are connected. For 5 V operation, VCC(5.0) is connected to a 5 V source (4.0 to 5.5 V). The internal voltage regulator then produces 3.3 V for the USB connections. For 3.3 V operation, both VCC(5.0) and Vreg(3.3) are connected to a 3.3 V source (3.0 - 3.6 V). VCC(I/O) is independently connected to a 1.8 V, 2.5 V or 3.3 V source, depending on the supply voltage of the external circuit. Disable mode -- VCC(I/O) is not connected, VCC(5.0)/Vreg(3.3) are connected. In this mode, the ISP1107's internal circuits ensure that the D+/D- pins are in three-state and the power consumption drops to the low-power (suspended) state level. Sharing mode -- VCC(I/O) is connected, VCC(5.0)/Vreg(3.3) are not connected. In this mode, the D+/D- pins are made three-state and the ISP1107 allows external signals of up to 3.6 V to share the D+/D- lines. The ISP1107's internal circuits ensure that virtually no current is drawn via the D+/D- lines. The power consumption through pin VCC(I/O) drops to the low-power (suspended) state level. Both the VP and VM pins are driven HIGH to indicate this mode.
Table 6: connected connected not connected Power supply configuration overview VCC(I/O) connected not connected connected Configuration Normal mode Disable mode Sharing mode Special characteristics D+/D- high impedance D+/D- are high impedance; VP/VM are driven HIGH
VCC(5.0)/Vreg(3.3)
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8. Limiting values
Table 7: Absolute maximum ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC(5.0) VCC(I/O) Vreg(3.3) VI Ilatchup Vesd Parameter supply voltage I/O supply voltage regulated supply voltage DC input voltage latchup current electrostatic discharge voltage [1] VI = -1.8 to 5.4 V ILI < 1 A pins D+, D- other pins Tstg
[1]
Conditions
Min -0.5 -0.5 -0.5 -0.5 -40
Max +6.0 +4.6 +4.6 VCC(I/O) + 0.5 100 8000 2000 +125
Unit V V V V mA V V C
storage temperature
Equivalent to discharging a 100 pF capacitor via a 1.5 k resistor (Human Body Model).
Table 8: Symbol VCC(5.0) VCC(I/O) Vreg(3.3) VI VI(AI/O) Tamb
Recommended operating conditions Parameter supply voltage I/O supply voltage regulated supply voltage input voltage input voltage on analog I/O pins (D+/D-) operating ambient temperature 3.3 V operation Conditions 5 V operation Min 4.0 1.65 3.0 0 0 -40 Typ 5.0 3.3 Max 5.5 3.6 3.6 VCC(I/O) 3.6 +85 Unit V V V V V C
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9. Static characteristics
Table 9: Static characteristics: supply pins VCC = 4.0 to 5.5 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = -40 to +85 C; unless otherwise specified. Symbol Vreg(3.3) ICC ICC(idle) Parameter regulated supply voltage operating supply current supply current during full-speed idle and SE0 suspend supply current operating I/O supply current static I/O supply current Conditions unloaded full-speed transmitting and receiving at 12 Mbit/s; CL = 50 pF on D+/D- full-speed idle: D+ > 2.7 V, D- < 0.3 V; SE0: D+ < 0.3 V, D- < 0.3 V SUSPND = HIGH full-speed transmitting and receiving at 12 Mbit/s full-speed idle, SE0 or suspend VCC(5.0)/Vreg(3.3) not connected VCC(5.0)/Vreg(3.3) not connected; SOFTCON = LOW; VDx = 3.6 V
[3] [3]
Min 3.0 [1] -
Typ 3.3 6 -
Max 3.6 10 [2] 500
Unit V mA A
ICC(susp) ICC(dis) ICC(I/O) ICC(I/O)(static)
[3] [3]
-
0.3 -
20 20 1 [2] 10 10 5
A A mA A A A
disable mode supply current VCC(I/O) not connected
ICC(I/O)(sharing) sharing mode I/O supply current IDx(sharing) sharing mode load current on pins D+ and D-
[3]
[1] [2] [3]
In `suspend' mode, the minimum voltage is 2.7 V. Characterized only, not tested in production. Excluding Vpu(3.3) source current to 1.5 k and 15 k pull-up and pull-down resistors (200 A typ.).
Table 10: Static characteristics: digital pins VCC = 4.0 to 5.5 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = -40 to +85 C; unless otherwise specified. Symbol Input levels VIL VIH Output levels VOL VOH LOW-level output voltage HIGH-level output voltage IOL = 100 A IOL = 4 mA IOH = 100 A IOH = 4 mA VCC(I/O) - 0.4 0.15 0.4 1 V V V V A LOW-level input voltage HIGH-level input voltage 0.6VCC(I/O) 0.3VCC(I/O) V V Parameter Conditions Min Typ Max Unit VCC(I/O) = 1.65 to 3.6 V
VCC(I/O) - 0.15 -
Leakage current ILI Input levels VIL VIH LOW-level input voltage HIGH-level input voltage 1.2 0.5 V V input leakage current VCC(I/O) = 1.8 V 0.15 V
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Table 10: Static characteristics: digital pins...continued VCC = 4.0 to 5.5 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = -40 to +85 C; unless otherwise specified. Symbol Output levels VOL VOH LOW-level output voltage HIGH-level output voltage IOL = 100 A IOL = 4 mA IOH = 100 A IOH = 4 mA 1.5 1.25 0.15 0.4 V V V V Parameter Conditions Min Typ Max Unit
VCC(I/O) = 2.5 V 0.2 V) Input levels VIL VIH Output levels VOL VOH LOW-level output voltage HIGH-level output voltage IOL = 100 A IOL = 4 mA IOH = 100 A IOH = 4 mA 2.15 1.9 0.15 0.4 V V V V LOW-level input voltage HIGH-level input voltage 1.7 0.7 V V
VCC(I/O) = 3.3 V 0.3 V Input levels VIL VIH Output levels VOL VOH LOW-level output voltage HIGH-level output voltage IOL = 100 A IOL = 4 mA IOH = 100 A IOH = 4 mA 2.85 2.6 0.2 0.4 V V V V LOW-level input voltage HIGH-level input voltage 2.15 0.9 V V
Table 11: Static characteristics: analog I/O pins (D+, D-) VCC = 4.0 to 5.5 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = -40 to +85 C; unless otherwise specified. Symbol Input levels Differential receiver VDI VCM differential input sensitivity differential common mode voltage LOW-level input voltage HIGH-level input voltage hysteresis voltage LOW-level output voltage HIGH-level output voltage OFF-state leakage current RL = 1.5 k to + 3.6 V RL = 15 k to GND |VI(D+) - VI(D-)| includes VDI range 0.2 0.8 2.5 V V Parameter Conditions Min Typ Max Unit
Single-ended receiver VIL VIH Vhys Output levels VOL VOH ILZ
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2.0 0.4 2.8 -
-
0.8 0.7 0.3 3.6 1
V V V V V A
Leakage current
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Advanced USB transceiver
Table 11: Static characteristics: analog I/O pins (D+, D-)...continued VCC = 4.0 to 5.5 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = -40 to +85 C; unless otherwise specified. Symbol Capacitance CIN Resistance ZDRV ZDRV2 ZINP RSW Termination VTERM [3] termination voltage for upstream port pull-up (RPU) 3.0 [4] 3.6 V driver output impedance driver output impedance for USB 2.0 input impedance internal switch resistance at pin Vpu(3.3) steady-state drive steady-state drive
[1] [2]
Parameter transceiver capacitance
Conditions pin to GND
Min 34 41 10 -
Typ 39 45 -
Max 20 44 49 10
Unit pF M
[1] [2] [3] [4]
Includes external resistors of 33 1% on both D+ and D-. Includes external resistors of 39 1% on both D+ and D-. This range complies with Universal Serial Bus Specification Rev. 2.0. This voltage is available at pins Vreg(3.3) and Vpu(3.3). In `suspend' mode the minimum voltage is 2.7 V.
10. Dynamic characteristics
Table 12: Dynamic characteristics: analog I/O pins (D+, D-) [1] VCC = 4.0 to 5.5 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = -40 to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Driver characteristics Full-speed mode tFR rise time CL = 50 to 125 pF; 10 to 90% of |VOH - VOL|; see Figure 4 CL = 50 to 125 pF; 90 to 10% of |VOH - VOL|; see Figure 4 excluding the first transition from Idle state excluding the first transition from Idle state; see Figure 7 CL = 200 to 600 pF; 10 to 90% of |VOH - VOL|; see Figure 4 CL = 200 to 600 pF; 90 to 10% of |VOH - VOL|; see Figure 4 excluding the first transition from Idle state
[2]
4
-
20
ns
tFF
fall time
4
-
20
ns
FRFM VCRS
differential rise/fall time matching (tFR/tFF) output signal crossover voltage rise time
90 1.3
-
111.1 2.0
% V
Low-speed mode tLR 75 300 ns
tLF
fall time
75
-
300
ns
LRFM
differential rise/fall time matching (tLR/tLF)
80
-
125
%
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Advanced USB transceiver
Table 12: Dynamic characteristics: analog I/O pins (D+, D-) [1]...continued VCC = 4.0 to 5.5 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = -40 to +85 C; unless otherwise specified. Symbol VCRS Driver timing Full-speed mode tPLH(drv) tPHL(drv) tPHZ tPLZ tPZH tPZL driver propagation delay (VO, FSE0 to D+,D-) driver disable delay (OE to D+,D-) driver enable delay (OE to D+,D-) LOW-to-HIGH; see Figure 7 HIGH-to-LOW; see Figure 7 HIGH-to-OFF; see Figure 5 LOW-to-OFF; see Figure 5 OFF-to-HIGH; see Figure 5 OFF-to-LOW; see Figure 5 15 15 10 10 15 15 ns ns ns ns ns ns Parameter output signal crossover voltage Conditions excluding the first transition from idle state; see Figure 7
[2]
Min 1.3
Typ -
Max 2.0
Unit V
Low-speed mode Not specified: low-speed delay timings are dominated by the slow rise/fall times tLR and tLF. Receiver timings (full-speed and low-speed mode) Differential receiver tPLH(rcv) tPHL(rcv) tPLH(se) tPHL(se)
[1] [2]
propagation delay (D+,D- to RCV)
LOW-to-HIGH; see Figure 6 HIGH-to-LOW; see Figure 6 LOW-to-HIGH; see Figure 6 HIGH-to-LOW; see Figure 6
-
-
15 15 15 15
ns ns ns ns
Single-ended receiver propagation delay (D+,D- to VP, VM)
Test circuit: see Figure 10. Characterized only, not tested. Limits guaranteed by design.
1.65 V logic input t FR, t LR VOH 90% 90% t FF, t LF 0V t PZH t PZL VOH differential data lines
MGS963
0.9 V
0.9 V
t PHZ t PLZ VOH -0.3 V
VCRS VOL +0.3 V
MGS966
10% VOL
10%
VOL
Fig 4. Rise and fall times.
2.0 V differential data lines 0.8 V t PLH(rcv) t PLH(se) VOH logic output VOL 0.9 V 0.9 V t PHL(rcv) t PHL(se) VCRS VCRS
Fig 5. Timing of OE to D+, D-.
1.65 V logic input 0V t PLH(drv) VOH differential data lines
MGS965
0.9 V
0.9 V
t PHL(drv)
VCRS
VCRS
VOL
MGS964
Fig 6. Timing of D+, D- to RCV, VP, VM.
Fig 7. Timing of VO, FSE0 to D+, D-.
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11. Test information
handbook, halfpage
test point 33 (1) D.U.T. 50 pF V
MBL142
500
V = 0 V for tPZH, tPHZ V = Vreg(/3.3) for tPZL, tPLZ (1) Complies with USB 1.1. For USB 2.0 a resistor of 39 must be used.
Fig 8. Load for enable and disable times.
handbook, halfpage
test point D.U.T. 25 pF
MGS968
Fig 9. Load for VM, VP and RCV.
handbook, halfpage
Vpu(3.3) 1.5 k (1) D+/D- 33 (2) CL 15 k
MGS967
D.U.T.
test point
Load capacitance: CL = 50 pF or 125 pF (full-speed mode, minimum or maximum timing) CL = 200 pF or 600 pF (low-speed mode, minimum or maximum timing) (1) Full-speed mode: connected to D+, low-speed mode: connected to D-. (2) Complies with USB 1.1. For USB 2.0 a resistor of 39 must be used.
Fig 10. Load for D+, D-.
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12. Package outline
Fig 11. BCC16 package outline (to be added).
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TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c y HE vMA
Z
16
9
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
8
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-04-04 99-12-27
Fig 12. TSSOP16 package outline.
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13. Soldering
13.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used.
13.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle
to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
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Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
13.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
13.5 Package related soldering information
Table 13: Suitability of surface mount IC packages for wave and reflow soldering methods Package BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC [3], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO
[1]
Soldering method Wave not suitable not suitable [2] Reflow [1] suitable suitable suitable suitable suitable
suitable not not recommended [3] [4] recommended [5]
[2]
[3] [4] [5]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
9397 750 06899
(c) Philips Electronics N.V. 2000. All rights reserved.
Objective specification
Rev. 01 -- 23 February 2000
15 of 19
Philips Semiconductors
ISP1107
Advanced USB transceiver
14. Revision history
Table 14: Revision history Rev Date 01 20000223 CPCN Description Objective specification; initial version.
9397 750 06899
(c) Philips Electronics N.V. 2000. All rights reserved.
Objective specification
Rev. 01 -- 23 February 2000
16 of 19
Philips Semiconductors
ISP1107
Advanced USB transceiver
15. Data sheet status
Datasheet status Objective specification Preliminary specification Product status Development Qualification Definition [1] This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Product specification
Production
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
16. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
17. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
9397 750 06899
(c) Philips Electronics N.V. 2000 All rights reserved.
Objective specification
Rev. 01 -- 23 February 2000
17 of 19
Philips Semiconductors
ISP1107
Advanced USB transceiver
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Tel. +43 160 101, Fax. +43 160 101 1210 Belarus: Tel. +375 17 220 0733, Fax. +375 17 220 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Tel. +359 268 9211, Fax. +359 268 9102 Canada: Tel. +1 800 234 7381 China/Hong Kong: Tel. +852 2 319 7888, Fax. +852 2 319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Tel. +45 3 288 2636, Fax. +45 3 157 0044 Finland: Tel. +358 961 5800, Fax. +358 96 158 0920 France: Tel. +33 14 099 6161, Fax. +33 14 099 6427 Germany: Tel. +49 40 23 5360, Fax. +49 402 353 6300 Hungary: see Austria India: Tel. +91 22 493 8541, Fax. +91 22 493 8722 Indonesia: see Singapore Ireland: Tel. +353 17 64 0000, Fax. +353 17 64 0200 Israel: Tel. +972 36 45 0444, Fax. +972 36 49 1007 Italy: Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Tel. +81 33 740 5130, Fax. +81 3 3740 5057 Korea: Tel. +82 27 09 1412, Fax. +82 27 09 1415 Malaysia: Tel. +60 37 50 5214, Fax. +60 37 57 4880 Mexico: Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Tel. +31 40 278 2785, Fax. +31 40 278 8399 New Zealand: Tel. +64 98 49 4160, Fax. +64 98 49 7811 Norway: Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Tel. +63 28 16 6380, Fax. +63 28 17 3474 Poland: Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Tel. +34 33 01 6312, Fax. +34 33 01 4107 Sweden: Tel. +46 86 32 2000, Fax. +46 86 32 2745 Switzerland: Tel. +41 14 88 2686, Fax. +41 14 81 7730 Taiwan: Tel. +886 22 134 2865, Fax. +886 22 134 2874 Thailand: Tel. +66 27 45 4090, Fax. +66 23 98 0793 Turkey: Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: Tel. +381 11 3341 299, Fax. +381 11 3342 553
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 272 4825
Internet: http://www.semiconductors.philips.com
(SCA69)
9397 750 06899
(c) Philips Electronics N.V. 2000. All rights reserved.
Objective specification
Rev. 01 -- 23 February 2000
18 of 19
Philips Semiconductors
ISP1107
Advanced USB transceiver
Contents
1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 8 9 10 11 12 13 13.1 13.2 13.3 13.4 13.5 14 15 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Function selection. . . . . . . . . . . . . . . . . . . . . . . 4 Operating functions. . . . . . . . . . . . . . . . . . . . . . 5 Power supply configurations. . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 Test information. . . . . . . . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 14 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 15 Package related soldering information . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
(c) Philips Electronics N.V. 2000.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 23 February 2000 Document order number: 9397 750 06899

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